Equipment and Module
Equipment and Module
Intertec Taiwan Corp has been started operation on 2001 and specializes in the buying and selling used equipment including Semiconductor, III-V compounds, LED, Diode, MEMS and TFT-LCD Industrial. We are selling high quality refurbished wafer process equipment including stepper, Track and CDSEM…etc. Our Service Technical team has multiple years of experience in modification, retrofit, customized design, trouble shooting and installation. We can delivery win-win solution to our customer to meet requirement and target.
| No | Category | Tool Name | Maker | Model | Size | Vintage | REMARKS | |
|---|---|---|---|---|---|---|---|---|
| B58 | ASSEMBLY | CHIP_MOUNTER | OKUHARA | MRS850 | 2015 | |||
| B59 | ASSEMBLY | FLIP_CHIP_BONDER | PANASONIC | FCX501-L | L size | 2004 | ||
| B60 | ASSEMBLY | FLIP_CHIP_BONDER | PANASONIC | FCX501-M | M size | 2006 | ||
| B61 | ASSEMBLY | WIRE_BONDER | AVIO | MB-2100 | ||||
| B62 | ASSEMBLY | WIRE_BONDER | KAIJO | FB900 | 2011 | |||
| B63 | ASSEMBLY | WIRE_BONDER | PANASONIC | HW27U-HＦ | 2004 | |||
| B64 | ASSEMBLY | WIRE_BONDER | SHINKAWA | UTC1000Super | 2003 | |||
| B65 | ASSEMBLY | WIRE_BONDER | SHINKAWA | UTC2000 | 2006 | |||
| B66 | ASSEMBLY | WIRE_BONDER | SHINKAWA | UTC2000super | 2007 | |||
| B67 | ASSEMBLY | WIRE_BONDER | WESTBOND | 7700D | 2005 | |||
| B68 | ASSEMBLY | WIRE_BONDER | WESTBOND | 7700D | 2005 | |||
| B69 | ASSEMBLY | BONDING_TESTER | DAGE | DAGE-4000PXY | 2006 | |||
| B70 | ASSEMBLY | BONDING_TESTER | DAGE | DAGE-4000PXY | ||||
| B71 | ASSEMBLY | BONDING_TESTER | DAGE | DAGE-4000PXY | 2007 | |||
| B72 | ASSEMBLY | BONDING_TESTER | DAGE | DAGE-5000P | 2006 | |||
| B73 | ASSEMBLY | BONDING_TESTER | DAGE | DAGE-5000PXY | 2008 | |||
| B74 | ASSEMBLY | BONDING_TESTER | RHESCA | PTR-1000 | ||||
| B75 | ASSEMBLY | FCB_BONDER | SHIBUYA | DBM200P | 2008 | |||
| B76 | ASSEMBLY | FCB_BONDER | SHIBUYA | DB253 | 2016 | |||
| B77 | ASSEMBLY | WIRE_BONDING_TESTER | KAIJO | wi-110F | 2008 | |||
| B78 | ASSEMBLY | WAFER_MOUNTER | MACHZONE | STM-12P | 2006 | pre cut tape | ||
| B79 | ASSEMBLY | DISPENSER | MUSASHI | FAD2100 | 2006 | |||
| B80 | ASSEMBLY | DISPENSER | MUSASHI | FAD2300-2S | 2007 | defect | ||
| B81 | ASSEMBLY | DISPENSER | MUSASHI | FAD600 | 2005 | |||
| B82 | ASSEMBLY | DISPENSER | MUSASHI | MPP-3 | ||||
| B83 | ASSEMBLY | DISPENSER | MUSASHI | MS-10D | ||||
| B84 | ASSEMBLY | DISPENSER | MUSASHI | SM500DS(3軸) SM500DS-3A | 2011 | |||
| B85 | ASSEMBLY | DESKTOP_TYPE_DISPENSING_ROBOT | MUSASHI | SM300DS-3A | 2009 | MPP-1 | ||
| B86 | ASSEMBLY | DESKTOP_TYPE_DISPENSING_ROBOT | MUSASHI | SM300S-4A(M25-1500) | 2005 | ML-808FXcom | ||
| B87 | ASSEMBLY | WAFER_SUBSRATE_TAPER | TAKATORI | VSM300M | 8,12 | 2007 | 12inch notch,8inch notch,8inch OF | |
| B88 | ASSEMBLY | TAPER | YAC GARTER | NCT-5100 | 2013 | LED | ||
| B89 | ASSEMBLY | TAPER | NITTO | DSA840 | 8 | 8inch Notch | ||
| B90 | ASSEMBLY | DETAPER | NITTO | HSA840 | 8 | 8inch Notch | ||
| B91 | ASSEMBLY | WAFER_EXPANDER | HUGLE | HS-1810 | 4 | 2003 | 2-6-1,Φ140mm_GRP-4 | |
| B92 | ASSEMBLY | EMBOSSED_TAPER | TENRYU SEIKI | TTM-EX01CS | 2007 | |||
| B93 | ASSEMBLY | OVEN | ESPEC | IPHH-202M | 2013 | 300℃,600x600x600mm | ||
| B94 | ASSEMBLY | OVEN | ESPEC | PHH-102 | 2010 | |||
| B95 | ASSEMBLY | OVEN | ESPEC | PU-1KP | 2010 | -40～+100℃ | ||
| B96 | ASSEMBLY | OVEN | ESPEC | PVC-211M | 2008 | 200℃,580x530x58mm | ||
| B97 | ASSEMBLY | OVEN | ESPEC | TSA-41L-A | 2005 | +60～+200℃,－65～0℃ | ||
| B98 | ASSEMBLY | OVEN | ESPEC | VAC-300PR | 2009 | 200℃,800x800x800mm | ||
| B99 | ASSEMBLY | OVEN | TABAI | PV-120 | 1998 | |||
| B100 | ASSEMBLY | OVEN | THERMO | VT6060P | 400℃,400x370x250mm | |||
| B101 | ASSEMBLY | OVEN | YAMATO | DE410 | 2005 | 260℃,450x450x450mm | ||
| B102 | ASSEMBLY | OVEN | YAMATO | DE610U | 2006 | 200℃,600x600x600 | ||
| B103 | ASSEMBLY | OVEN | YAMATO | DES82 | 2011 | |||
| B104 | ASSEMBLY | OVEN | YAMATO | DES82 | 2011 | |||
| B105 | ASSEMBLY | OVEN | YAMATO | DES82 | 2011 | |||
| B106 | ASSEMBLY | OVEN | YAMATO | DES82 | 2011 | |||
| B107 | ASSEMBLY | OVEN | YAMATO | DF411 | 2009 | 260℃,450x450x450mm | ||
| B108 | ASSEMBLY | OVEN | YAMATO | DP23 | ||||
| B109 | ASSEMBLY | OVEN | DAN-TAKUMA | FA620 | 1999 | 250℃,600x600x600mm | ||
| B110 | ASSEMBLY | AUTOCLAVE | KYOSIN ENGINEERING | HP-5055AAH | 2010 | φ450×D500mm | ||
| B111 | ASSEMBLY | MOLDING_EQUIPMENT | NFT | Across R2--100 | 2016 | |||
| B112 | ASSEMBLY | UV_IRRADIATION | EYE GRAPHICS | 401GX | 250mm | 2005 | mercury lamp | |
| B113 | ASSEMBLY | UV_IRRADIATION | HUGLE | HS-6080 | 6 | |||
| B114 | ASSEMBLY | UV_IRRADIATION | LINTEC | RAD-1000 | 2000 | |||
| B115 | ASSEMBLY | UV_IRRADIATION | LINTEC | RAD-2000F8 | 6&8 | 2013 | semi auto | |
| B116 | ASSEMBLY | UV_IRRADIATION | LINTEC | RAD-2000M/6 | 6 | 2004 | ||
| B117 | ASSEMBLY | UV_IRRADIATION | LINTEC | RAD-2000/M12 | 6~12 | 2006 | semi auto | |
| B118 | ASSEMBLY | UV_IRRADIATION | TECHNOVISION | UVC-408 | 2005 | |||
| B119 | ASSEMBLY | UV_IRRADIATION | TECHNOVISION | UVC-408 | 8 | 2007 | ||
| B120 | ASSEMBLY | X_RAY | TOSHIBA | α5090U | 2004 | 90kV | ||
| B121 | ASSEMBLY | CHIP_SORTER | CANON(NEC) | CAP-300Ⅱ | 8 | 2013 | DTF2-8-1 | |
| B122 | ASSEMBLY | CHIP_SORTER | CANON(NEC) | CAP-300Ⅱ | 8 | 2008 | DTF2-8-1 | |
| B123 | ASSEMBLY | CHIP_SORTER | CANON(NEC) | CAP-3500 | 12 | 2005 | DTF2-12-1→JEDEC | |
| B124 | ASSEMBLY | CHIP_SORTER | SHINKAWA | DPS-250 | 8 | 2006 | DTF2-8-1→JEDEC | |
| B125 | ASSEMBLY | WAFER_CLEANER | DISCO | DCS-141 | 6 | 2008 | ||
| B126 | ASSEMBLY | PLASMA_CLEANER | PANASONIC | PC30B-HS | ||||
| B127 | ASSEMBLY | PLASMA_CLEANER | PANASONIC | PSX303M | 2007 | board size:W62xL234x2 rows | ||
| B128 | ASSEMBLY | PLASMA_CLEANER | PANASONIC | PSX303M | 2008 | board size:W62xL234x2 rows,defect | ||
| B129 | ASSEMBLY | UV OZONE CLEANER | SAMCO | UV-1 | 1987 | |||
| B130 | ASSEMBLY | UV OZONE CLEANER | TECHNOVISION | UVO-312 | 308x308mm | |||
| B131 | ASSEMBLY | TEMPERATURE CHARACTERISTIC EVALUATION SYSTEM | THERMONICS | T2500E | 2008 | |||
| B132 | ASSEMBLY | PRINTER | MINAMI | MK-280SA | 1999 | |||
| B133 | ASSEMBLY | PRINTER | MINAMI | DELTA-10 | 2016 | |||
| B134 | ASSEMBLY | PRINTER | SONOCOM | SC-150 | ||||
| B136 | ASSEMBLY | MICROSCOPE | KEYENCE | VK-9510 | 2012 | |||
| B137 | ASSEMBLY | MICROSCOPE | NIKON | ECLIPS L200 | ||||
| B138 | ASSEMBLY | MICROSCOPE | NIKON | SMZ800 | 2001 | |||
| B139 | ASSEMBLY | MICROSCOPE | OLYMPUS | BX60MF5 | 4 | 2000 | 5/10/50/100/150,CCD | |
| B140 | ASSEMBLY | MICROSCOPE | OLYMPUS | BX61 | auto stage | |||
| B141 | ASSEMBLY | MICROSCOPE | UNION | HISOMET | ||||
| B142 | ASSEMBLY | CHILLER | DISCO | DTU-150 | 1997 | |||
| B143 | ASSEMBLY | CHILLER | DISCO | DTU-151 | 2000 | |||
| B144 | ASSEMBLY | CHILLER | DISCO | DTU-151 | 2000 | |||
| B145 | ASSEMBLY | CNC_CMM | NIKON | VM-500N | 1998 | |||
| B146 | ASSEMBLY | CHIP_DEFECT_INSPECTION_SYSTEM | TOPCON | Vi-1202 | 8 | 2009 | ||
| B147 | ASSEMBLY | CHIP_DEFECT_INSPECTION_SYSTEM | TOPCON | Vi-4202 | 5 | 2007 | DTF2-6-1,5inch | |
| B148 | ASSEMBLY | CHIP_DEFECT_INSPECTION_SYSTEM | TOPCON | Vi-4202 | 5 | 2007 | ||
| B149 | ASSEMBLY | CHIP_DEFECT_INSPECTION_SYSTEM | TOPCON | Vi-4202 | 5 | 2007 | DTF2-6-1,5inch | |
| B150 | ASSEMBLY | VAPOR_PHASE_REFOLW | R&D Vapor Tech Inc. | RD-1 | 2015 | |||
| B151 | ASSEMBLY | REFLOW | ANTOM | UNI-5016A | 2016 | |||
| B152 | ASSEMBLY | REFLOW | OKUHARA | SAR-500N2 | 2006 | |||
| B153 | ASSEMBLY | REFLOW | SENJYU | STR-2010N2M | 1998 | |||
| B154 | ASSEMBLY | REFLOW | TAMURA | TNV25-308EM-P | 2018 | |||
| B155 | ASSEMBLY | LASER_MAKER | KEYENCE | 3-Axis YVO4 LASER MAKER | 2000 | |||
| B156 | ASSEMBLY | POLISHER | BUEHLER | ECOMET4 | 2001 | manual | ||
| B157 | ASSEMBLY | ULTRASONIC_CUTTING_SYSTEM | TAKADA | CSX-100Lab | 2016 | 100φ,□75mm | ||
| B158 | ASSEMBLY | PARAMETER ANALYZER | AGILENT | 4155A |